Cervoz Co., Ltd. (Taiwan) - Press Release: The future will be fast-paced, thanks to 5G technology and edge computing. Delays in data transmission will be virtually nonexistent, and network operations will be near instantaneous. While edge computing has existed before 5G networks' rollout, the dawn of the 5G era means that the two can work hand-in-hand to provide higher bandwidth and lower latency than ever before in computing and processing. With the speed of 5G and the convenience of edge computing, so many smart applications, for factories, traffic, AR/VR, etc., can and are becoming realities.

Requirements & Challenges:

The interconnected ecosystem formed by network technology, edge computing and applications is commonly referred to as the Internet of Things. The interconnectivity underlying the network is what allows machines to communicate with each other and intelligently operate. As technological advancements continue to take place, we are in the early stages of mobile multi-access edge computing (MEC), which further decentralizes running applications and performing related processes so that it is closer to the end users. While we are still a way off from this capability, it is time to think about the architecture of it all.

For MEC to work, memory capacity is a top priority. Memory is what allows for the storage, reading and transmission of data—the fundamentals of IoT—and as such, the memory modules used for the technology must be topnotch. These memory solutions need to be high-performing and infallibly reliable. If 5G is the latest in network technology, its memory parts need to be the most advanced as well.

The ideal storage and memory solutions need to process massive amounts of data fast, without consuming too much power or overheating easily. Otherwise, the conveniences of decentralized processing would be undermined and eliminated. Furthermore, security features are needed to keep data safe from hacks while still allowing for control and oversight for management, analysis and usage of said data.

Solutions:

Cervoz has been preparing for the future by designing and developing storage and memory solutions that work for the network. Our M.2 2280 NVMe SSD uses TLC technology for a high IOPS, as well as End-to-End Data Protection so data integrity is always maintained. Even while operating at such intensity, the SSDs can keep from overheating because of our dynamic thermal throttling feature and heatsink kit. The former is a software mechanism that automatically slows down performance if the device gets too hot, while the latter is a hardware that assists in the cooling down process.  

For volatile memory, Cerovz offers the DDR4 32GB 3200MHz DRAM Module, which boasts high capacity and high performance, all the while consuming less power than previous models.