VIA Technologies, Inc. (Taiwan) - Press Release: VIA Technologies, Inc. announced the launch of the ruggedized VIA AMOS-3007 Intelligent Edge System for the most demanding Industrial IoT use cases ranging from equipment monitoring and process automation to rich data visualization and facilities management.
Powered by a fanless 1.5GHz Intel® Atom® quad core processor, the VIA AMOS-3007 packs a rich I/O and connectivity feature set in a ruggedized ultra-compact enclosure measuring just 70mm (W) x 48.5mm (H) x 126mm (D). The system’s wall and VESA mounting options ensure that it can be easily fitted into the most constrained spaces, and its wide operating temperature range of -20°C to 70°C ensures continued reliable operation in almost every work environment.
The VIA AMOS-3007 solution provides a wealth of I/O and connectivity options, including two Gigabit Ethernet ports, two lockable USB 2.0 and two USB 3.0 ports, two HDMI connectors supporting dual display, two COM ports, and one DIO port for 8-bit GPIO. Internal expansion options including three M.2 slots for SATA storage and wireless expansion models, one 4G/5G SIM card slot, and one DDR4 SODIMM slot that supports up to 32GB of memory.
“The VIA AMOS-3007 provides the complete package of high performance, low power, and rich I/O connectivity required for the most demanding IIoT use cases,” said Richard Brown, VP of International Marketing, VIA Technologies, Inc. “With its ruggedized design and support for a wide operating temperature range, this robust, ultra-compact system delivers rock-solid reliability in the toughest operating environments.”
About VIA Technologies, Inc.:
VIA Technologies, Inc. is a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions for the most demanding use cases and deployment environments.
Headquartered in Taipei, Taiwan, VIA operates a global network that links the high-tech centers of the US, Asia, and Europe and spans a customer base that includes many of the world’s leading hi-tech, manufacturing, and transportation enterprises.