Cervoz Provides the Industrial Computing Storage Solutions for Fleet Management
- September 20, 2018
Cervoz Co., Ltd. (Taiwan) - In modern transportation applications, enterprise fleets often rely on digitalized management integrated with IoT to ensur...
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TECHBASE updates ModBerry M500 series
- September 18, 2018
TECHBASE Group (Poland) - The latest version of Raspberry Pi development board, Raspberry Pi Model 3 B+, is now available as a platform for ModBerry M...
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VIA Launches VIA SOM-6X80 Module for Automated Information Display and Ticketing Systems
- July 30, 2018
VIA Technologies, Inc. (Taiwan) - Enables rapid design, development, and deployment for retail, transportation, and industrial environments. VIA Te...
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VIA Launches VIA Edge AI Developer Kit Powered by Qualcomm® Snapdragon™ 820E Embedded Platform
- May 23, 2018
VIA Technologies, Inc. (Taiwan) – Speeds up time-to-market for smart camera, signage, kiosk, and robotics systems and devices optimized for video AI a...
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Xilinx Unveils Revolutionary Adaptable Computing Product Category
- April 06, 2018
Xilinx, Inc. (USA) – Xilinx, Inc., leader in adaptive and intelligent computing, announced a new breakthrough product category called adaptive compute...
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First SMARC Computer-on-Module from eCOUNT embedded with Intel® Cyclone® V SoC
- April 04, 2018
eCOUNT embedded GmbH (Germany) – SMARC module for Industrial Ethernet. eCOUNT embedded presents the ES-1XXX, its first Computer-on-Module family to su...
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Congatec supports new NXP i.MX8 processors on Qseven and SMARC modules
- November 25, 2017
Congatec AG (Germany) – Congatec modules accelerate first-to-market strategies. congatec – a leading technology company for embedded computer modules,...
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VIA Launches VIA SOM-9X20 Featuring Qualcomm® Snapdragon™ 820 Embedded Platform
- November 03, 2017
VIA Technologies, Inc. (Taiwan) – Highly-integrated ultra-compact system-on-module accelerates development of next-generation Enterprise IoT and embed...
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Everysight and Qualcomm Announce Reshaping of the Cycling Experience with Raptor AR Smartglasses
- November 02, 2017
Everysight (Israel) – Everysight Uses the Qualcomm® Snapdragon™ 410E Embedded Platform to Deliver Outstanding Performance, Connectivity, and Battery L...
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Testing SMARC 2.0 Modules
- October 26, 2017
Yamaichi Electronics Deutschland GmbH (Germany) – The test adapter for the SMARC computer-on- module standard, developed by Yamaichi Electronics, is a...
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Enabling Industrial Robot Control with DFI’s Rugged Qseven Module
- September 18, 2017
DFI (South Korea) – DFI BT700 Module Trains Robots with Daincube DTP7-P Teach Pendant. A teach pendant simplifies robot programming, but the internal...
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DDC-I and Vector Software Announce Availability of VectorCAST Test Automation Platform for Deos DO-178 Safety-Critical RTOS
- September 04, 2017
Vector Software, Inc. (USA) – Speeds time to market for developing, testing, and certifying C/C++ and Ada software for DO-178 safety-critical applicat...
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ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots
- August 28, 2017
ADLINK Technology, Inc. (Taiwan) – Offering 65W CPUs in a fanless chassis and the robust construction of all ADLINK MXC/MXE products, at a new value p...
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What if You Could Have the Most Suitable Embedded Boards for Your IoT Solution?
- August 20, 2017
DFI Inc. (Taiwan) – "What if You Could Have the Most Suitable Embedded Boards for Your IoT Solution?" asked DFI. As the Internet of Things (IoT) moves...
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ARBOR Introduces The EmETXe-i90M0 COM Express Basic Type 6 module with 7th Generation Intel® Core™ Processor
- August 07, 2017
ARBOR Technology Corp. (Taiwan) – ARBOR Technology, a leading provider of embedded computing solutions, announces the release of the ARBOR EmETXe-i90M...
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DFI Tech Announces New 7th Generation Intel Atom SoC Motherboards
- May 30, 2017
DFI Tech (USA) – DFI Tech, a provider of embedded computing solutions and board products, has released new motherboards using the latest generation lo...
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Pixus Offers New Development Embedded Chassis Platform with Removable Sidewalls
- May 10, 2017
Pixus Technologies (Canada) - Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a development enclosure for 3U,...
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VIA to Debut VIA VTS-8589 OPS Board at Embedded World 2017
- March 09, 2017
VIA Technologies, Inc. (Taiwan) – VIA Technologies, Inc., announced the it will debut its new VIA VTS-8589 OPS board at the 2017 Embedded World Exhibi...
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NEXCOM EBC 357X Series of 3.5” Boards Elevates Processing Power in Human-Machine Interfaces
- March 09, 2017
NEXCOM International Co., Ltd. (Taiwan) – NEXCOM’s EBC 357X series of 3.5” boards improves processing power and enhances display performance in a reli...
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DFI Tech Offers i.MX6 SoC Version of Qseven Modules
- February 08, 2017
DFI Tech (USA) – DFI Tech, a provider of embedded computing solutions and board products, now offers a 1-4 core i.MX6 NXP (formerly Freescale) version...
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